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zc18 C z - power cob product data sheet product brief description key applications features and benefits rev1.0, july 19, 2013 www.seoulsemicon.com 1 superior high flux for high current system SDW03F1C, sdw83f1c z power chip on board C zc series, zc18 table 1. product selection table part number cct color min. typ. max. SDW03F1C cool white 4700k 5300k 6000k sdw83f1c warm white 3000k sdw83f1c warm white 2700k ? super high flux output and high luminance ? designed for high current operation ? design flexibility ? macadam 3 - step ? lead free product ? rohs compliant ? the zc(z - power chip on board) series are high flux and high efficiency. ? it is cob (chip on board) series designed for easy to attach to lighting fixture directly without reflow process. ? zc series' thermal management perform exceeds other power led solutions. ? macadam 3 step, 4 - step available including ansi. ? provide cob total solution available(optic, reflector, holder etc.) ? the z - power led is ideal light sources for general illumination applications, custom designed solutions, and high performance lights. ? down light / par ? architectural lighting ? decorative / pathway lighting 19 x 19 ( ? ) rohs
rev1.0, july 19, 2013 www.seoulsemicon.com product data sheet zc18 C z - power cob 2 table of contents index ? product brief ? table of contents ? product nomenclature ( labeling information ) ? performance characteristics - relative spectral distribution - luminous flux characteristics - forward current characteristics - junction temperature characteristics - ambient temperature characteristics ? color bin structure ? packagi ng information - mechanical dimensions - tray packaging structure - packing (bag & box) ? handling of silicone resin for leds ? precaution for use ? revision history ? company information
rev1.0, july 19, 2013 www.seoulsemicon.com product data sheet zc18 C z - power cob 3 product nomenclature part number code description part number value x 1 company s x 2 package series d x 3 color specification w0 white x 4 w8 cri 80 x 5 series number 3 x 6 lens type f flat x 7 pcb type 1 pcb x 8 revision number c new cob type lot number code description lot number value y 1 y 2 year y 3 y 4 month y 5 y 6 day y 7 y 8 y 9 y 10 mass order y 11 y 12 y 13 tray no. table 2. part numbering system : x 1 x 2 x 3 x 4 x 5 x 6 x 7 x 8 table 3. lot numbering system : y 1 y 2 y 3 y 4 y 5 y 6 C y 7 y 8 y 9 y 10 C y 11 y 12 y 13
rev1.0, july 19, 2013 www.seoulsemicon.com product data sheet zc18 C z - power cob 4 performance characteristics table 4. product selection guide, t a = 25oc, rh30% notes : 1. correlated color temperature is derived from the cie 1931 chromaticity diagram. color coordinate : ? 0.01, cct ? 5% tolerance. 2. ssc maintains a tolerance of 7% on flux and power measurements. 3. v is the total luminous flux output as measured with an integrating sphere. 4. tolerance is 2.5v on forward voltage measurements. 5. tolerance is 2 on cri measurements. * calculated performance values are for reference only. part number cct (k) [1] typical luminous flux [2] v [3] (lm) typical forward voltage ( v f ) [4] cri [5] , r a viewing angle (degrees) 2 ? typ. 500ma 640ma* 500ma 640ma* min. typ. SDW03F1C 5000 2520 3090 37 38.5 70 120 sdw83f1c 3000 2150 2640 37 38.5 80 120 sdw83f1c 2700 2050 2520 37 38.5 80 120
rev1.0, july 19, 2013 www.seoulsemicon.com product data sheet zc18 C z - power cob 5 performance characteristics table 5. characteristics, t a = 25oc, rh30% notes : 1. i f ? 640ma 2. at thermal resistance, j to s means junction to cobs metal pcb bottom. 3. a zener diode is included to protect the product from esd. parameter symbol value unit min. typ. max. forward current i f - 0.5 0.64 a power dissipation p d - 18.6 24.4 w junction temperature [1] t j - - 125 oc operating temperature t opr - 40 - 85 oc storage temperature t stg - 40 - 100 oc thermal resistance (j to s) r j - s - 0.7 - k/w esd sensitivity(hbm) [2] - - - 8 kv
rev1.0, july 19, 2013 www.seoulsemicon.com product data sheet zc18 C z - power cob 6 relative spectral distribution product data sheet fig 1. color spectrum, ta = 25 , if = 500ma, rh30% 300 400 500 600 700 800 0.0 0.2 0.4 0.6 0.8 1.0 relative radiant power [%] cool white warm white wavelength [nm]
rev1.0, july 19, 2013 www.seoulsemicon.com product data sheet zc18 C z - power cob 7 luminous flux characteristics product data sheet fig 2. radiant pattern, if = 500ma -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 relative intensity [%] angular displacement [degrees]
rev1.0, july 19, 2013 www.seoulsemicon.com product data sheet zc18 C z - power cob 8 forward current characteristics product data sheet fig 3. forward voltage vs. forward current , ta=25 fig 4. forward current vs. relative luminous flux, ta=25 10 15 20 25 30 35 40 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 forward current [a] forward volatage [v] 0 100 200 300 400 500 600 700 0 20 40 60 80 100 120 140 relative luminous flux [%] forward current [ma]
rev1.0, july 19, 2013 www.seoulsemicon.com product data sheet zc18 C z - power cob 9 forward current characteristics product data sheet fig 5. forward current vs. cie x, y shift , ta=25 (warm white) 0 50 100 150 200 250 300 350 400 450 500 -0.02 -0.01 0.00 0.01 0.02 relative variation forward current [ma] cie(x) cie(y)
rev1.0, july 19, 2013 www.seoulsemicon.com product data sheet zc18 C z - power cob 10 product data sheet junction temperature characteristics fig 6. relative light output vs. junction temperature, if=500ma fig 7. junction temp. vs. cie x, y shift, if=500ma ( warm white) 40 60 80 100 120 0 20 40 60 80 100 120 relative luminous flux [%] junction temperature [ o c ] 25 50 75 100 125 150 -0.02 -0.01 0.00 0.01 0.02 relative variation junction temperature [ o c ] cie(x) cie(y)
rev1.0, july 19, 2013 www.seoulsemicon.com product data sheet zc18 C z - power cob 11 ambient temperature characteristics product data sheet fig 8. maximum forward current vs. ambient temperature, tj (max.) = 125 , if=0.64a rth (j - a)=1.4k/w rth (j - a)=2.2k/w rth (j - a)=3.0k/w 0 20 40 60 80 100 120 0 100 200 300 400 500 600 700 800 ambient temperature [ o c ] maximum current [ma]
rev1.0, july 19, 2013 www.seoulsemicon.com product data sheet zc18 C z - power cob 12 color bin structure part number luminous flux (lm) @ i f = 500ma color chromaticity coordinate @ i f = 500ma typical forward voltage ( v f ) bin code min. max. bin code min. max. SDW03F1C h1 1800 2400 refer to page.13 d 32.0 36.0 h2 2400 2900 e 36.0 40.0 sdw83f1c g2 1600 1800 refer to page.14 d 32.0 36.0 h1 1800 2400 e 36.0 40.0 table 6. bin code description
rev1.0, july 19, 2013 www.seoulsemicon.com product data sheet zc18 C z - power cob 13 color bin structure b0 b1 b2 b3 b4 cie x cie y cie x cie y cie x cie y cie x cie y cie x cie y 0.3207 0.3462 0.3292 0.3539 0.3212 0.3389 0.3293 0.3461 0.3217 0.3316 0.3212 0.3389 0.3293 0.3461 0.3217 0.3316 0.3293 0.3384 0.3222 0.3243 0.3293 0.3461 0.3373 0.3534 0.3293 0.3384 0.3369 0.3451 0.3294 0.3306 0.3292 0.3539 0.3376 0.3616 0.3293 0.3461 0.3373 0.3534 0.3293 0.3384 b5 b6 b7 b8 b9 cie x cie y cie x cie y cie x cie y cie x cie y cie x cie y 0.3293 0.3384 0.3222 0.3243 0.3294 0.3306 0.3200 0.3572 0.3290 0.3656 0.3294 0.3306 0.3226 0.3178 0.3295 0.3234 0.3207 0.3462 0.3292 0.3539 0.3366 0.3369 0.3295 0.3234 0.3364 0.3288 0.3292 0.3539 0.3376 0.3616 0.3369 0.3451 0.3294 0.3306 0.3366 0.3369 0.3290 0.3656 0.3381 0.3740 c0 c1 c2 c3 c4 cie x cie y cie x cie y cie x cie y cie x cie y cie x cie y 0.3376 0.3616 0.3463 0.3687 0.3373 0.3534 0.3456 0.3601 0.3369 0.3451 0.3373 0.3534 0.3456 0.3601 0.3369 0.3451 0.3448 0.3514 0.3366 0.3369 0.3456 0.3601 0.3539 0.3669 0.3448 0.3514 0.3526 0.3578 0.3440 0.3428 0.3463 0.3687 0.3552 0.3760 0.3456 0.3601 0.3539 0.3669 0.3448 0.3514 c5 c6 c7 c8 c9 cie x cie y cie x cie y cie x cie y cie x cie y cie x cie y 0.3448 0.3514 0.3366 0.3369 0.3440 0.3428 0.3381 0.3740 0.3470 0.3810 0.3440 0.3428 0.3364 0.3288 0.3433 0.3345 0.3376 0.3616 0.3463 0.3687 0.3514 0.3487 0.3433 0.3345 0.3500 0.3400 0.3463 0.3687 0.3552 0.3760 0.3526 0.3578 0.3440 0.3428 0.3514 0.3487 0.3470 0.3810 0.3572 0.3891 cie chromaticity diagram (cool white ), ta=25 , if=500ma 0.32 0.33 0.34 0.35 0.36 0.31 0.32 0.33 0.34 0.35 0.36 0.37 0.38 6000k 5600k 5300k 5000k 4700k ansi c5 c3 c1 c4 c2 c0 b5 b3 b1 b4 b2 b0 cie y cie x
rev1.0, july 19, 2013 www.seoulsemicon.com product data sheet zc18 C z - power cob 14 color bin structure cie chromaticity diagram ( warm white), ta=25 , if=500ma ansi g21 g22 g23 g24 cie x cie y cie x cie y cie x cie y cie x cie y 0.4223 0.3990 0.4406 0.4055 0.4147 0.3814 0.4259 0.3853 0.4299 0.4165 0.4451 0.4145 0.4223 0.3990 0.4302 0.3943 0.4430 0.4212 0.4387 0.4122 0.4284 0.4011 0.4361 0.3964 0.4387 0.4122 0.4430 0.4212 0.4243 0.3922 0.4406 0.4055 0.4324 0.4100 0.4562 0.4260 0.4302 0.3943 0.4468 0.4077 0.4284 0.4011 0.4468 0.4077 0.4259 0.3853 0.4373 0.3893 h21 h22 h23 h24 cie x cie y cie x cie y cie x cie y cie x cie y 0.4468 0.4077 0.4644 0.4118 0.4373 0.3893 0.4483 0.3919 0.4562 0.4260 0.4697 0.4211 0.4468 0.4077 0.4534 0.4012 0.4687 0.4289 0.4636 0.4197 0.4526 0.4090 0.4591 0.4025 0.4636 0.4197 0.4687 0.4289 0.4477 0.3998 0.4644 0.4118 0.4575 0.4182 0.4810 0.4319 0.4534 0.4012 0.4703 0.4132 0.4526 0.4090 0.4703 0.4132 0.4483 0.3919 0.4593 0.3944 3 - step 4 - step g10 h10 g11 h11 cie x cie y cie x cie y cie x cie y cie x cie y 0.4267 0.3946 0.4502 0.4020 0.4242 0.3919 0.4475 0.3994 0.4328 0.4079 0.4576 0.4158 0.4322 0.4096 0.4573 0.4178 0.4422 0.4113 0.4667 0.4180 0.4449 0.4141 0.4695 0.4207 0.4355 0.3977 0.4588 0.4041 0.4359 0.396 0.4589 0.4021 0.42 0.44 0.46 0.48 0.36 0.38 0.40 0.42 0.44 0.46 h11 g11 h10 h24 h23 h22 h21 g24 g23 g22 g21 3-step (g10, h10) 4-step (g11, h11) ansi 2600k 2900k 3000k 2700k 3200k cie x cie y g10
rev1.0, july 19, 2013 www.seoulsemicon.com product data sheet zc18 C z - power cob 15 mechanical dimensions notes : 1. all dimensions are in millimeters. 2. scale : none 3. undefined tolerance is 0.2mm x 12 x 12 x 12 x 12 cathode anode circuit
rev1.0, july 19, 2013 www.seoulsemicon.com product data sheet zc18 C z - power cob 16 tray packing structure 1. quantity : 20pcs/tray 2. all dimensions are in millimeters (tolerance : 0.3) 3. scale none notes :
rev1.0, july 19, 2013 www.seoulsemicon.com product data sheet zc18 C z - power cob 17 packaging (bag and box) - humidity indicator - desiccant 1. moisture - proof bag *1,2 2. outer box structure x 9 x 10 x 11 x 12 x 13 x 1 x 2 x 3 x 4 x 5 x 6 x 7 x 8 20 x 9 x 10 x 11 x 12 x 13 x 1 x 2 x 3 x 4 x 5 x 6 x 7 x 8 1 side 1 notes : 1. heat sealed after packing (use zipper bag) 2. quantity : 1 tray(20pcs) /bag : max 2 bag /box( ? 80), max 4 bag /box( ? 142)
rev1.0, july 19, 2013 www.seoulsemicon.com product data sheet zc18 C z - power cob 18 handling of silicone resin for leds (1) during processing, mechanical stress on the surface should be minimized as much as possible. sharp objects of all types should not be used to pierce the sealing compound. (3) silicone differs from materials conventionally used for the manufacturing of leds. these conditions must be considered during the handling of such devices. compared to standard encapsulants , silicone is generally softer, and the surface is more likely to attract dust. as mentioned previously , the increased sensitivity to dust requires special care during processing. in cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of wire. (4) ssc suggests using isopropyl alcohol for cleaning. in case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. ultrasonic cleaning is not recommended. ultrasonic cleaning may cause damage to the led. (5) please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this product with acid or sulfur material in sealed space. (6) avoid leaving fingerprints on silicone resin parts. (2) in general, leds should only be handled from the side. by the way, this also applies to leds without a silicone sealant, since the surface can also become scratched.
rev1.0, july 19, 2013 www.seoulsemicon.com product data sheet zc18 C z - power cob 19 precaution for use (1) storage to avoid the moisture penetration, we recommend storing power leds in a dry box with a desiccant . the recommended storage temperature range is 5c to 30c and a maximum humidity of 50%. (2) use precaution after opening the packaging. pay attention to the following: a. recommend conditions after opening the package - sealing - temperature : 5 ~ 40 humidity : less than rh30% b. if the package has been opened more than 4 week or the color of the desiccant changes. (3) for manual soldering ssc recommends the soldering condition (zc series product is not adaptable to reflow process) a. use lead - free soldering b. soldering should be implemented using a soldering equipment at temperature lower than 350 c. c. before proceeding the next step, product temperature must be stabilized at room temperature. (4) components should not be mounted on warped (non coplanar) portion of pcb. (5) radioactive exposure is not considered for the products listed here in. (6) it is dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed of. (7) this device should not be used in any type of fluid such as water, oil, organic solvent and etc. when washing is required, ipa (isopropyl alcohol) should be used. (8) when the leds are in operation the maximum current should be decided after measuring the package temperature. (9) leds must be stored properly to maintain the device. if the leds are stored for 3 months or more after being shipped from ssc, a sealed container with vacuum atmosphere should be used for storage. (10) the appearance and specifications of the product may be modified for improvement without notice . (11) long time exposure of sun light or occasional uv exposure will cause silicone discoloration. (12) attaching leds, do not use adhesive that outgas organic vapor. (13) the driving circuit must be designed to allow forward voltage only when it is on or off. if the reverse voltage is applied to led, migration can be generated resulting in led damage. (14) please do not touch any of the circuit board, components or terminals with bare hands or metal while circuit is electrically active. ( 15) vocs (volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of leds and discolor when exposed to heat and photonic energy. the result can be a significant loss of light output from the fixture. knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues.
rev1.0, july 19, 2013 www.seoulsemicon.com product data sheet zc18 C z - power cob 20 revision history published by seoul semiconductor ? 2013 all rights reserved. company information seoul semiconductor (seoulsemicon.com) manufacturers and packages a wide selection of light emitting diodes (leds) for the automotive, general illumination/lighting, appliance, signage and back lighting markets. the company is the worlds fifth largest led supplier, holding more than 10,000 patents globally, while offering a wide range of led technology and production capacity in areas such as npola , deep uv leds, " acrich ", the worlds first commercially produced ac led, and " acrich mjt - multi - junction technology" a proprietary family of high - voltage leds. the companys broad product portfolio includes a wide array of package and device choices such as acrich , high - brightness leds, mid - power leds, side - view leds, through - hole type led lamps, custom displays, and sensors. the company is vertically integrated from epitaxial growth and chip manufacture in its fully owned subsidiary, seoul optodevice , through packaged leds and led modules in three seoul semiconductor manufacturing facilities. seoul optodevice also manufactures a wide range of unique deep - uv wavelength devices. legal disclaimer information in this document is provided in connection with seoul semiconductor products. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, seoul semiconductor hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non - infringement of intellectual property rights of any third party. the appearance and specifications of the product can be changed to improve the quality and/or performance without notice . revision date page remarks 1.0 2013 - 07 - 12 all initial release of preliminary data sheet applied

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